Ibhodi le-Plain/raw/particle board

Incazelo emfushane:

I-particle board-eyaziwa nangokuthi i-chipboard kanye ne-low-density fibreboard (LDF), iwumkhiqizo wokhuni owenziwe ngobunjiniyela owenziwe ngamapulangwe okhuni, amapulangwe omshini wokusaha, noma ngisho ne-sawdust, kanye ne-synthetic resin noma esinye isibophezelo esifanele, esicindezelwa futhi sikhishwe.
Ngezinye izikhathi zisetshenziswa njengenye indlela ye-plywood noma i-medium density fiberboard ukuze kwehliswe izindleko zokwakha.
Izindleko zayo ziphansi kakhulu phezu kokhuni oluqinile noma i-plywood.
Isisindo esilula sikwenza kube lula ukuthutha nokuhambahamba.
Isikhathi sokuguqulwa sincane kakhulu uma siqhathaniswa ne-post lamination.


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Imikhiqizo Ukucaciswa

Igama lomkhiqizo Ibhodi lezinhlayiyana ezingenalutho / i-chipboard / ibhodi le-flake
Izinto ezibalulekile i-wood fiber (i-poplar, i-pine, i-birch noma i-combi)
Usayizi 1220*2440mm, 915*2440mm, 915x2135mm noma njengoba kudingeka
Ubukhulu 8-25mm (2.7mm, 3mm, 6mm, 9mm, 12mm, 15mm, 18mm noma ngesicelo)
Ukubekezelela ukuqina +/- 0.2mm-0.5mm
Ukwelashwa kwendawo Isihlabathi noma Cindezelwe
Glue E0/E2 /CARP P2
Umswakama 8%-14%
Ukuminyana 600-840kg/M3
I-Modulus Elasticity ≥2500Mpa
Amandla okugoba amile ≥16Mpa
Isicelo I-Plain particleboard isetshenziselwa kakhulu ifenisha, ikhabethe kanye nokuhlobisa kwangaphakathi.Enezici ezinhle, amandla okugoba aphezulu, amandla okubamba isikulufu esiqinile, ukumelana nokushisa, okulwa nokuqina, okuhlala isikhathi eside futhi akukho mphumela wesizini.
Ukupakisha 1) Ukupakisha kwangaphakathi: Iphalethi elingaphakathi ligoqwe ngesikhwama sepulasitiki esingu-0.20mm
2) Ukupakisha kwangaphandle: Amaphalethi ambozwe ngebhokisi bese kuba amateyipu ensimbi ukuze aqinise;

Impahla

I-chipboard isetshenziswa kakhulu ukwenza ifenisha, imisebenzi yangaphakathi, ukwenza ukwahlukanisa odongeni, ama-countertops, amakhabethe, ukufakwa komsindo (kwebhokisi lesipika) kanye nomgogodla weminyango eshaywayo njll...
1. Inomunca kahle umsindo kanye nokusebenza kokufakwa kwe-insulation;Ukufakwa kwe-thermal kanye nokumuncwa komsindo kwebhodi lezinhlayiyana;
2. Ingaphakathi liyisakhiwo esiyimbudumbudu esinezakhiwo eziphambanayo nezimangelengele, ngokuyisisekelo sinesiqondiso esifanayo kuzo zonke izingxenye kanye nekhono elihle lokuthwala imithwalo esemaceleni;
3. Ibhodi lezinhlayiya linendawo eyisicaba, ukuthungwa okungokoqobo, isisindo seyunithi efanayo, iphutha elincane lokujiya, ukumelana nokungcola, ukumelana nokuguga, ukubukeka okuhle, futhi ingasetshenziselwa ama-veneers ahlukahlukene;Inani leglue elisetshenzisiwe lincane kakhulu, futhi i-coefficient yokuvikela imvelo iphakeme kakhulu.


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