Ibhodi le-Plain/raw/particle board
Imikhiqizo Ukucaciswa
Igama lomkhiqizo | Ibhodi lezinhlayiyana ezingenalutho / i-chipboard / ibhodi le-flake |
Izinto ezibalulekile | i-wood fiber (i-poplar, i-pine, i-birch noma i-combi) |
Usayizi | 1220*2440mm, 915*2440mm, 915x2135mm noma njengoba kudingeka |
Ubukhulu | 8-25mm (2.7mm, 3mm, 6mm, 9mm, 12mm, 15mm, 18mm noma ngesicelo) |
Ukubekezelela ukuqina | +/- 0.2mm-0.5mm |
Ukwelashwa kwendawo | Isihlabathi noma Cindezelwe |
Glue | E0/E2 /CARP P2 |
Umswakama | 8%-14% |
Ukuminyana | 600-840kg/M3 |
I-Modulus Elasticity | ≥2500Mpa |
Amandla okugoba amile | ≥16Mpa |
Isicelo | I-Plain particleboard isetshenziselwa kakhulu ifenisha, ikhabethe kanye nokuhlobisa kwangaphakathi.Enezici ezinhle, amandla okugoba aphezulu, amandla okubamba isikulufu esiqinile, ukumelana nokushisa, okulwa nokuqina, okuhlala isikhathi eside futhi akukho mphumela wesizini. |
Ukupakisha | 1) Ukupakisha kwangaphakathi: Iphalethi elingaphakathi ligoqwe ngesikhwama sepulasitiki esingu-0.20mm 2) Ukupakisha kwangaphandle: Amaphalethi ambozwe ngebhokisi bese kuba amateyipu ensimbi ukuze aqinise; |
Impahla
I-chipboard isetshenziswa kakhulu ukwenza ifenisha, imisebenzi yangaphakathi, ukwenza ukwahlukanisa odongeni, ama-countertops, amakhabethe, ukufakwa komsindo (kwebhokisi lesipika) kanye nomgogodla weminyango eshaywayo njll...
1. Inomunca kahle umsindo kanye nokusebenza kokufakwa kwe-insulation;Ukufakwa kwe-thermal kanye nokumuncwa komsindo kwebhodi lezinhlayiyana;
2. Ingaphakathi liyisakhiwo esiyimbudumbudu esinezakhiwo eziphambanayo nezimangelengele, ngokuyisisekelo sinesiqondiso esifanayo kuzo zonke izingxenye kanye nekhono elihle lokuthwala imithwalo esemaceleni;
3. Ibhodi lezinhlayiya linendawo eyisicaba, ukuthungwa okungokoqobo, isisindo seyunithi efanayo, iphutha elincane lokujiya, ukumelana nokungcola, ukumelana nokuguga, ukubukeka okuhle, futhi ingasetshenziselwa ama-veneers ahlukahlukene;Inani leglue elisetshenzisiwe lincane kakhulu, futhi i-coefficient yokuvikela imvelo iphakeme kakhulu.